Hello Everyone,
I have a few questions regarding packaging solutions and what are priority areas that the members are seeing as. I would like to learn more about the major challenges seen in this industry and how Ansys can help create solutions around it. A small introduction of Ansys:
"Ansys Inc. is a global leader in engineering simulation software, empowering innovators to design, test, and optimize complex products and systems across industries. With its advanced simulation software, Ansys can help packaging companies reduce material waste, minimize environmental impact, and ensure regulatory compliance, driving business success and product innovation."
After going through this forum, I can see these topics:
- Structural Integrity and Load-Bearing Analysis
- Drop Test and Impact Loading case
- Thermal Insulation and Barrier Performance
- Forming and Molding Process
- Adhesive and Sealing Performance
- Printing and Labeling Process Optimization
- Vibration and Transport Simulation
I want to understand if I missed anything and within these topics which causes major pains to companies.
Thanks in advance! Looking forward to your thoughts on it.
Regards,
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Ashutosh Srivastava
Principal Application Engineer
2645 Zanker Road / San Jose CA 95134
www.ansys.com------------------------------